教育背景
2015.5 – 2016.5,新加坡国立大学,电子与计算机工程系,访问学者
2006.9 – 2009.6,中科院半导体所,微电子学与固体电子学,工学博士
2004.9 – 2006.7,华中科技大学,电子科学与技术,理学硕士
2000.9 – 2004.6,华中科技大学,光电子科学与技术,工学学士
工作简历
2009.7-2011.9, 中科院BWIN必赢(中国),助理研究员
2011.10-2018.3,中科院BWIN必赢(中国),副研究员
2018.4-至今 中科院BWIN必赢(中国) 研究员
作为负责人先后承担了国家自然科学基金青年/ 面上基金,02专项、03专项、并与华为、中兴等项企业开展多项横向项目的合作研究。
1、Fengman Liu, Binbin Yang,et al., A Surface Mounting Embedded Optical Transceiver with Bi-directional Data Rate of 8 Channels × 10Gbps, Fiber and Integrated Optics, 2014, 33(1-2): 17-25
2、Yi He, Fengman Liu, et al., Design and implementation of a 700–2600 MHz RF SiP module for micro base station, Microsystem Technology, 2014, 20:2295-2300
3、Yi He, Fengman Liu,et al., Design and Implementation of Two Different RF SiP for Micro Base Station, 2014 IEEE 16th Electronics Packaging Technology Conference, EPTC 2014, 2014.12.3-2014.12.5
4、Huimin He,Fengman Liu, et al., Research on Optical Transmitter and Receiver Module Used for High-Speed Interconnection between CPU and Memory, Fiber and Integrated Optics, 2016
5、Peng Wu,Fengman Liu, et al., Design and implementation of a rigid-flex RF front-end system-in-package. Microsystem Technology, 2016
6、Huimin He , Fengman Liu, et al.,Design and implementation of a high-coupling and multi-channel optical transceiver with a novel packaging structure,IEEE Transactions on Components, Packaging and Manufacturing Technology, 2156-3950, 2017.
7、Jun Liu,Fengman Liu, et al., Design and Verification of Sub-6GHz RoF Transceiver Employing LR4 TOSA and ROSA Packaging Structure,Microwave and Optical Technology Letters, 2018
申请专利40余项,授权20余项。
人才队伍